WebNov 1, 2001 · Gold wire bonding to aluminum pad is a widely applied interconnection method in microelectronics industry for years. Copper wire bonding has gained popularity due to its economic advantage and… Expand 26 View 3 excerpts, cites results and background De-bonding simulation of Cu-Al wire bond intermetallic compound layers P. … WebApr 10, 2013 · Wire bonding is the predominant mode of interconnection in microelectronic packaging. Gold wire bonding has been refined again and again to retain control of interconnect technology due to its ease of workability and years of reliability data. Copper (Cu) wire bonding is well known for its advantages such as cost-effectiveness and better …
Growth behavior of Cu/Al intermetallic compounds and cracks in …
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Effects of Cu/Al intermetallic compound (IMC) on copper wire and ...
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