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WebHAL or Hot Air Leveling means that the production panel is vertically dipped into a bath of liquid tin. While pulling the panel out of the bath, two hot air knives blow of the surplus of Tin so the holes are again free and all pads and planes are nicely flat. More on finish in our BLOG. Back to Technical Terms and Abbreviations. WebAs a result, you can reduce the component’s PCB footprint by 85 percent. Figure 1. Example of a Cypress BGA Product BGA packages provide a shorter conductor path between the die and the PCB/FPC because they use a substrate instead of a lead frame. The shorter path provides lower inductance, which results in better electrical performance, malisafashion.com

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